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Editor Name: Ephraim Suhir
Designation: Professor
University: Portland State University
Country: USA
Biography: Ephraim Suhir is on the faculty of the Portland State
University, Portland, OR, USA, Technical University, Vienna, Austria and James
Cook University, Queensland, Australia. He is also CEO of a Small Business
Innovative Research (SBIR) ERS Co. in Los Altos, CA, USA, is Foreign
Full Member (Academician) of the National Academy of Engineering,
Ukraine (he was born in that country); Life Fellow of the Institute of
Electrical and Electronics Engineers (IEEE), the American Society of Mechanical
Engineers (ASME), the Society of Optical Engineers (SPIE), and the
International Microelectronics and Packaging Society (IMAPS);
Fellow of the American Physical Society (APS), the Institute of
Physics (IoP), UK, and the Society of Plastics Engineers (SPE); and Associate
Fellow of the American Institute of Aeronautics and Astronautics
(AIAA). Ephraim has authored 450+ publications (patents,
technical papers, book chapters, books), presented numerous keynote and invited
talks worldwide, and received many professional awards, including
1996 Bell Laboratories Distinguished Member of Technical Staff (DMTS) Award
(for developing effective methods for predicting the reliability of complex
structures used in AT&T and Lucent Technologies products), and 2004 ASME
Worcester Read Warner Medal (for outstanding contributions to the permanent
literature of engineering and laying the foundation of a new discipline
“Structural Analysis of Electronic Systems”). Ephraim is the third “Russian
American”, after S. Timoshenko and I. Sikorsky, who received this prestigious
award. His most recent awards are 2019 IEEE Electronic Packaging Society (EPS) Field
award for seminal contributions to mechanical reliability engineering
and modeling of electronic and photonic packages and systems and 2019 Int.
Microelectronic Packaging Society’s (IMAPS) Lifetime Achievement award for making exceptional, visible,
and sustained impact on the microelectronics packaging industry and technology. RESEARCH INTERESTS
Ø Applied Mathematics and Mechanics, Applied
and Mathematical Physics Ø Analytical (Mathematical) Modeling in Applied Science and Engineering Ø Materials Science and Engineering Ø Aerospace and Automotive Electronics and Photonics Ø Design for Reliability (DfR) of Electronic, Opto-Electronic and
Photonic Assemblies, Packages and Systems Ø Applied Probability and Probabilistic DfR (PDfR) of Electronic and
Photonic Materials, Devices and Systems Ø Photonics, Fiber Optics, Mechanics of Optical Fibers Ø Thin Film Mechanics and Physics Ø Shock and Vibration Analyses and Testing Ø Dynamic Response of Materials and Structures to Shocks and Vibrations Ø Thermal Stress Analysis, Prediction and Prevention of Thermal Stress
Failures in Electronics and Photonics Ø Solder Materials and Solder Joint Interconnections in Electronic and
Photonic Engineering Ø Polymeric Materials in Electronics and Photonics Ø Photovoltaic and Thermo-Electric Modules: Physical Design for
Reliability Ø Stretchable (Large Area) Electronics and Photonics: Physical Design for
Reliability Ø Lattice-Misfit Systems: Stress Analysis and Reliability Evaluations Ø Technical Diagnostics, Prognostics and Health Monitoring (PHM) Ø Vehicular (Aerospace, Automotive, Maritime, Railroad) Electronics and
Photonics: Design for Reliability Ø “Human-in-the-Loop”: Human-System Interaction and Integration, with an
emphasis on analytical modeling
Editor Name: Ephraim Suhir
Designation: Professor
University: Portland State University
Country: USA
Biography:
Editor Name: Ephraim Suhir
Designation: Professor
University: James Cook University
Country: USA
Biography: Ephraim Suhir is on the faculty of the Portland State University, Portland, OR, USA, Technical University, Vienna, Austria and James Cook University, Queensland, Australia. He is also CEO of a Small Business Innovative Research (SBIR) ERS Co. in Los Altos, CA, USA, is Foreign Full Member (Academician) of the National Academy of Engineering, Ukraine (he was born in that country); Life Fellow of the Institute of Electrical and Electronics Engineers (IEEE), the American Society of Mechanical Engineers (ASME), the Society of Optical Engineers (SPIE), and the International Microelectronics and Packaging Society (IMAPS); Fellow of the American Physical Society (APS), the Institute of Physics (IoP), UK, and the Society of Plastics Engineers (SPE); and Associate Fellow of the American Institute of Aeronautics and Astronautics (AIAA). Ephraim has authored 400+ publications (patents, technical papers, book chapters, books), presented numerous keynote and invited talks worldwide, and received many professional awards, including 1996 Bell Laboratories Distinguished Member of Technical Staff (DMTS) Award (for developing effective methods for predicting the reliability of complex structures used in AT&T and Lucent Technologies products), and 2004 ASME Worcester Read Warner Medal (for outstanding contributions to the permanent literature of engineering and laying the foundation of a new discipline “Structural Analysis of Electronic Systems”). Ephraim is the third “Russian American”, after S. Timoshenko and I. Sikorsky, who received this prestigious award. This year he received the 2019 IEEE Electronic Packaging Society (EPS) Field award for seminal contributions to mechanical reliability engineering and modeling of electronic and photonic packages and systems and Int. Microelectronic Packaging Society’s (IMAPS) Lifetime Achievement award for making exceptional, visible, and sustained impact on the microelectronics packaging industry and technology.