International Journal of Material Science and Research

ISSN: 2638-1559


Keynote Session Abstracts

3rd International Conference on Materials Science and Research
Nov 28-29, 2019, Kuala Lumpur, Malaysia

Evolution on Lead Solder Alloy for Electronic Packaging

Int J Mater Sci Res. 2019

DOI: 10.18689/2638-1559.a3.001

Author(s): Ervina Efzan M. N* and Nurfaziera M. N