International Journal of Material Science and Research

ISSN: 2638-1559

Collaboration

Keynote Session Abstracts

3rd International Conference on Materials Science and Research
Nov 28-29, 2019, Kuala Lumpur, Malaysia

Natural Aloe vera as a Sustainable Electronic Material for Neuromorphic Computing

Int J Mater Sci Res. 2019

DOI: 10.18689/2638-1559.a3.001

Author(s): Kuan Yew Cheong* and Zhe Xi Liml

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Graphene Material for Microelectronic Devices and Circuits: Challenges and Perspectives

Int J Mater Sci Res. 2019

DOI: 10.18689/2638-1559.a3.001

Author(s): Yuhua Cheng*, Jin Peng and Lele Jiang

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Evolution on Lead Solder Alloy for Electronic Packaging

Int J Mater Sci Res. 2019

DOI: 10.18689/2638-1559.a3.001

Author(s): Ervina Efzan M. N* and Nurfaziera M. N

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